Precision tool for the semicon


Precision tool for the semicon
Edge Wheel for Silicon and Sapphire Wafers



Edge grinding wheel for bevel machining of semiconductor material substrates.

Thanks to a design featuring a uniform layer of fine grains and high-precision finishing technology, this grinding wheel makes high-quality, high-precision machining possible with minimal chipping.

Both outer-circumference machining and notch machining wheels are available in three types: single-groove, multi-groove, and composite rough finishing.


· Even and ne diamond layer minimizes processing damage.

· Wear resistant bond with a high grain holding force is used to achieve high shap eretention and a long life.

· Highly precise slotted shape and nishing technology support various wafer shapes.

· Copper-less supported.



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